| LDR | | 02921nam u200457 4500 |
| 001 | | 000000418389 |
| 005 | | 20190215162825 |
| 008 | | 181129s2018 |||||||||||||||||c||eng d |
| 020 | |
▼a 9780438017092 |
| 035 | |
▼a (MiAaPQ)AAI10748638 |
| 035 | |
▼a (MiAaPQ)purdue:22384 |
| 040 | |
▼a MiAaPQ
▼c MiAaPQ
▼d 247004 |
| 082 | 0 |
▼a 621 |
| 100 | 1 |
▼a Drummond, Kevin P. |
| 245 | 10 |
▼a Characterization of Manifold Microchannel Heat Sinks During Two-Phase Operation. |
| 260 | |
▼a [S.l.]:
▼b Purdue University.,
▼c 2018. |
| 260 | 1 |
▼a Ann Arbor:
▼b ProQuest Dissertations & Theses,
▼c 2018. |
| 300 | |
▼a 202 p. |
| 500 | |
▼a Source: Dissertation Abstracts International, Volume: 79-10(E), Section: B. |
| 500 | |
▼a Advisers: Suresh V. Garimella |
| 502 | 1 |
▼a Thesis (Ph.D.)--Purdue University, 2018. |
| 520 | |
▼a High-heat-flux removal is necessary for next-generation microelectronic systems to operate more reliably and efficiently. The direct embedding of microchannel heat sinks into the heated substrate serves to reduce the parasitic thermal resistance |
| 520 | |
▼a A 3 x 3 array of heat sinks is fabricated into a heated silicon substrate for direct intrachip cooling. The heat sinks are fed in parallel using a hierarchical manifold distributor that is designed to deliver equal flow to each of the heat sinks |
| 520 | |
▼a The thermal and hydraulic performance of each heat sink array geometry is evaluated using the engineered dielectric liquid HFE-7100 as the working fluid and for mass fluxes ranging from 600 kg/m2s to 2100 kg/m 2s at a constant inlet temperature |
| 520 | |
▼a During uniform heating conditions, heat fluxes up to 1020 W/cm 2 are dissipated at chip temperatures less than 69 °C above the fluid inlet and at pressure drops less than 120 kPa. Heat sinks with wider channels yield higher wetted-area heat tran |
| 520 | |
▼a The ability to fabricate and assemble a chip-integrated, compact hierarchical manifold used to deliver fluid to a 9 x 9 array of heat sinks has been demonstrated, with feature sizes significantly reduced compared to the 3 x 3 array of heat sinks |
| 520 | |
▼a An experiment is designed to provide simultaneous high-speed flow visualization and spatially-resolved wall temperature measurements on a single manifold microchannel. Visualizing the flow morphology inside the channel during two-phase operation |
| 590 | |
▼a School code: 0183. |
| 650 | 4 |
▼a Mechanical engineering. |
| 650 | 4 |
▼a Fluid mechanics. |
| 690 | |
▼a 0548 |
| 690 | |
▼a 0204 |
| 710 | 20 |
▼a Purdue University.
▼b Mechanical Engineering. |
| 773 | 0 |
▼t Dissertation Abstracts International
▼g 79-10B(E). |
| 773 | |
▼t Dissertation Abstract International |
| 790 | |
▼a 0183 |
| 791 | |
▼a Ph.D. |
| 792 | |
▼a 2018 |
| 793 | |
▼a English |
| 856 | 40 |
▼u http://www.riss.kr/pdu/ddodLink.do?id=T14996998
▼n KERIS
▼z 이 자료의 원문은 한국교육학술정보원에서 제공합니다. |
| 980 | |
▼a 201812
▼f 2019 |
| 990 | |
▼a ***1012033 |