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001 | | 000000418662 |
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008 | | 181129s2018 |||||||||||||||||c||eng d |
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▼a 9780438371323 |
035 | |
▼a (MiAaPQ)AAI10845023 |
035 | |
▼a (MiAaPQ)purdue:23232 |
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▼a MiAaPQ
▼c MiAaPQ
▼d 247004 |
082 | 0 |
▼a 620.11 |
100 | 1 |
▼a Holaday, John R. |
245 | 10 |
▼a Transient Liquid Phase Bonding for High Temperature Interconnects. |
260 | |
▼a [S.l.]:
▼b Purdue University.,
▼c 2018. |
260 | 1 |
▼a Ann Arbor:
▼b ProQuest Dissertations & Theses,
▼c 2018. |
300 | |
▼a 116 p. |
500 | |
▼a Source: Dissertation Abstracts International, Volume: 80-02(E), Section: B. |
500 | |
▼a Adviser: Carol A. Handwerker. |
502 | 1 |
▼a Thesis (Ph.D.)--Purdue University, 2018. |
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▼a Transient liquid phase bonding (TLPB) is a type of interdiffusion bonding between metals that has been proposed for a variety of electronic interconnect applications. TLPB has been studied as an alternative to other high temperature interconnect |
520 | |
▼a Research studies involving TLPB can be categorized into two types of work. Proof-of-concept studies have demonstrated the feasibility of producing TLP bonds using materials and methods either common to current commercial electronics manufacturin |
520 | |
▼a A second type of TLPB research has focused instead on characterizing underlying processing mechanisms such as the kinetics of IMC formation in specific TLPB candidate systems such as Cu-Sn or Ag-Sn. Solid-liquid interdiffusion couples were proce |
520 | |
▼a In the work presented in this thesis, a comprehensive approach is taken to TLPB design encompassing both practical bond engineering concerns but also applying analysis of key materials science concepts. First, the key thermodynamic concepts requ |
590 | |
▼a School code: 0183. |
650 | 4 |
▼a Materials science. |
690 | |
▼a 0794 |
710 | 20 |
▼a Purdue University.
▼b Materials Engineering. |
773 | 0 |
▼t Dissertation Abstracts International
▼g 80-02B(E). |
773 | |
▼t Dissertation Abstract International |
790 | |
▼a 0183 |
791 | |
▼a Ph.D. |
792 | |
▼a 2018 |
793 | |
▼a English |
856 | 40 |
▼u http://www.riss.kr/pdu/ddodLink.do?id=T15000033
▼n KERIS
▼z 이 자료의 원문은 한국교육학술정보원에서 제공합니다. |
980 | |
▼a 201812
▼f 2019 |
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▼a ***1012033 |