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020 ▼a 9780438371323
035 ▼a (MiAaPQ)AAI10845023
035 ▼a (MiAaPQ)purdue:23232
040 ▼a MiAaPQ ▼c MiAaPQ ▼d 247004
0820 ▼a 620.11
1001 ▼a Holaday, John R.
24510 ▼a Transient Liquid Phase Bonding for High Temperature Interconnects.
260 ▼a [S.l.]: ▼b Purdue University., ▼c 2018.
260 1 ▼a Ann Arbor: ▼b ProQuest Dissertations & Theses, ▼c 2018.
300 ▼a 116 p.
500 ▼a Source: Dissertation Abstracts International, Volume: 80-02(E), Section: B.
500 ▼a Adviser: Carol A. Handwerker.
5021 ▼a Thesis (Ph.D.)--Purdue University, 2018.
520 ▼a Transient liquid phase bonding (TLPB) is a type of interdiffusion bonding between metals that has been proposed for a variety of electronic interconnect applications. TLPB has been studied as an alternative to other high temperature interconnect
520 ▼a Research studies involving TLPB can be categorized into two types of work. Proof-of-concept studies have demonstrated the feasibility of producing TLP bonds using materials and methods either common to current commercial electronics manufacturin
520 ▼a A second type of TLPB research has focused instead on characterizing underlying processing mechanisms such as the kinetics of IMC formation in specific TLPB candidate systems such as Cu-Sn or Ag-Sn. Solid-liquid interdiffusion couples were proce
520 ▼a In the work presented in this thesis, a comprehensive approach is taken to TLPB design encompassing both practical bond engineering concerns but also applying analysis of key materials science concepts. First, the key thermodynamic concepts requ
590 ▼a School code: 0183.
650 4 ▼a Materials science.
690 ▼a 0794
71020 ▼a Purdue University. ▼b Materials Engineering.
7730 ▼t Dissertation Abstracts International ▼g 80-02B(E).
773 ▼t Dissertation Abstract International
790 ▼a 0183
791 ▼a Ph.D.
792 ▼a 2018
793 ▼a English
85640 ▼u http://www.riss.kr/pdu/ddodLink.do?id=T15000033 ▼n KERIS ▼z 이 자료의 원문은 한국교육학술정보원에서 제공합니다.
980 ▼a 201812 ▼f 2019
990 ▼a ***1012033