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020 ▼a 9781085773201
035 ▼a (MiAaPQ)AAI13885154
040 ▼a MiAaPQ ▼c MiAaPQ ▼d 247004
0820 ▼a 620.11
1001 ▼a Berg, Alexander Hillel Klaimitz.
24510 ▼a TiO2 and NiO:Cu Carrier-Selective Barrier Layers for Heterojunction Solar Cells.
260 ▼a [S.l.]: ▼b Princeton University., ▼c 2019.
260 1 ▼a Ann Arbor: ▼b ProQuest Dissertations & Theses, ▼c 2019.
300 ▼a 214 p.
500 ▼a Source: Dissertations Abstracts International, Volume: 81-04, Section: B.
500 ▼a Advisor: Sturm, James C.
5021 ▼a Thesis (Ph.D.)--Princeton University, 2019.
506 ▼a This item must not be sold to any third party vendors.
520 ▼a Next-generation solar cell designs will figure significantly in the approaching green energy mix. This thesis makes contributions to both the modeling and the materials of these devices. External quantum efficiency-based measurements of PEDOT/n- Si/TiO2 solar cells are used, in conjunction with modeling, to extract the surface recombination velocity of the n-Si/CVD-TiO2 interface. It is also shown that even very thin layers of ALD-TiO2 can effectively passivate crystalline silicon, though even the thinnest layers contribute measurably to the hole barrier. The increase in surface recombination velocity after ALD-NiO overlayer deposition is linked to changes in the TiO2 stoichiometry as measured by XPS. We also present significant contributions to the transient electrical modeling of double-heterojunction silicon solar cells. It is shown how these measurements can be used to determine both the front- and back-interface recombination velocities in fully fabricated solar cells. Physics-based modeling is combined with full device simulations to account for geometric effects, and the full results are applied to measurements of PEDOT/n-Si and PEDOT/n-Si/TiO2 heterojunction solar cells, showing that emitter efficiency is an increasingly significant problem in these devices as the back interface is made more ideal. Next, a thorough account is given of a novel ALD-NiO deposition process, outlining how changes in deposition parameters change the content of the resulting films. A process is also developed to fabricate ALD-CuO, and the two are integrated to give, for the first time, Cu-doped NiO deposited by ALD. The copper is shown to increase film conductivity, an effect corroborated by spectroscopic band measurements. ALD-NiO is shown to depin the interfacial Fermi level in NiO/c-Si diodes
590 ▼a School code: 0181.
650 4 ▼a Electrical engineering.
650 4 ▼a Materials science.
690 ▼a 0544
690 ▼a 0794
71020 ▼a Princeton University. ▼b Electrical Engineering.
7730 ▼t Dissertations Abstracts International ▼g 81-04B.
773 ▼t Dissertation Abstract International
790 ▼a 0181
791 ▼a Ph.D.
792 ▼a 2019
793 ▼a English
85640 ▼u http://www.riss.kr/pdu/ddodLink.do?id=T15491419 ▼n KERIS ▼z 이 자료의 원문은 한국교육학술정보원에서 제공합니다.
980 ▼a 202002 ▼f 2020
990 ▼a ***1816162
991 ▼a E-BOOK