대구한의대학교 향산도서관

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저널기사
Interfacial Microstructure and Intermetallics Developed in the Interface between In Solders and Au/Ni/Ti Thin Films during Reflow Process: / Shin, K.;Cho, W.-G.;Kim, Y.-H.; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2003 /