대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
Effect of Annealing on the Surface Microstructural Evolution and the Electromigration Reliability of Electroplated Cu Films: / Kang, S. H.;Obeng, Y. S.;Decker, M. A.; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2001 /