대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
Effect of Cooling Rate on Microstructure and Mechanical Properties of Eutectic Sn-Ag Solder Joints with and without Intentionally Incorporated Cu~6Sn~5 Reinforcements: / Sigelko, J.;Choi, S.;Subramanian, K. N.; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 1999 /