대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
An Improved Numerical Method for Predicting Intermetallic Layer Thickness Developed during the Formation of Solder Joints on Cu Substrates: / Chada, S.;Laub, W.;Fournelle, R. A.; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 1999 /