대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging: / Huang, M. L. ;Wu, C. M. L. ;Lai, J. K. L. ; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2000 /