대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects: / Kariya, Y.,Hosoi, T.,Terashima, S.,Tanaka, M. / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2004 /