대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
Microstructure and Shear Strength Evolution of SnAg/Cu Surface Mount Solder Joint during Aging: / Ahat, Shawkret;Sheng, Mei;Luo, Le; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2001 /