대구한의대학교 향산도서관

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검색간략리스트

1.
저널기사
Isothermal Solidification of Cu/Sn Diffusion Couples to Form Thin-Solder Joints: / Kang, J S ;Gagliano, R A ;Ghosh, G ; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2002 /