자료유형 | 학위논문 |
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서명/저자사항 | Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders. |
개인저자 | Reeve, Thomas C. |
단체저자명 | Purdue University. Materials Engineering. |
발행사항 | [S.l.]: Purdue University., 2018. |
발행사항 | Ann Arbor: ProQuest Dissertations & Theses, 2018. |
형태사항 | 264 p. |
기본자료 저록 | Dissertation Abstracts International 79-10B(E). Dissertation Abstract International |
ISBN | 9780438018549 |
학위논문주기 | Thesis (Ph.D.)--Purdue University, 2018. |
일반주기 |
Source: Dissertation Abstracts International, Volume: 79-10(E), Section: B.
Adviser: Carol A. Handwerker. |
요약 | The solidification of the beta-Sn phase in Sn-based solder alloys is often unpredictable and difficult to induce, commencing heterogeneously from a highly-undercooled liquid. In addition, the crystal structure of beta-Sn is highly anisotropic an |
요약 | My work has examined the nucleation, growth, and structure of beta-Sn via the implementation of the following thermodynamic and solidification approaches: (1) Al micro-alloying additions, (2) introduction of inoculating phases, and (3) introduct |
요약 | First, the effects of Al micro-alloying on common industrial solder alloys was examined. In our initial studies, Al additions resulted in a range of microstructure effects, including the formation of Cu-Al IMCs. Through collaboration with collea |
요약 | Through continued collaborations with ISU, Ames Lab, and Nihon-Superior, the potential nucleant relationship between CuxAly and Cu6Sn5 was explored as a means to manipulate the number and size of Cu6Sn5 nucleation sites through the particle size |
요약 | For Cu6Sn5, a bimodal size distribution was observed for the alloy with Cu6Sn5 phase temperature stability of 240 °C, with large, faceted growth of Cu6Sn5, while the alloy with Cu6Sn5 phase temperature stability of 267 °C displayed no significan |
일반주제명 | Materials science. Engineering. |
언어 | 영어 |
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