대구한의대학교 향산도서관

선택목록저장

검색간략리스트

저널기사
The Effect of Small Additions of Copper on the Aging Kinetics of the Intermetallic Layer and Intermetallic Particles of Eutectic Tin-Silver Solder Joints: / Sigelko, J.;Choi, S.;Subramanian, K. N.; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2000 /
항목 :