대구한의대학교 향산도서관

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REGULAR ISSUE PAPERS - Joint Shape, Microstructure, and Shear Strength of Lead-Free Solder Joints with Different Component Terminations: / Ahat, Shawkret ;Weidong, Huang ;Mei, Sheng ; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2002 /
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