대구한의대학교 향산도서관

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저널기사
Scanning Electron Microscopy Study of the Cross Section of Intermetallic Compound in the Solder Ball on the Plastic Ball Grid Array Package Following Reliability Tests: / Duann, Y.-F.,Chiang, J.-H.,Yang, S.-J. / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2005 /
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