대구한의대학교 향산도서관

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저널기사
Intermetallic Reactions in a Sn-20In-2.8Ag Solder Ball-Grid-Array Package with Au/Ni/Cu Pads: / Wu, Hui-Min,Wu, Feng-Chih,Chuang, Tung-Han / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2005 /
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