대구한의대학교 향산도서관

선택목록저장

검색간략리스트

저널기사
“Seedless” Electrochemical Deposition of Copper on Physical Vapor Deposition-W₂N Liner Materials for Ultra Large Scale Integration (ULSI) Devices: / Shaw, Michael J.;Grunow, Stephan;Duquette, David J.; / Institute of Electrical and Electronics Engineers / Journal of Electronic Materials / 2001 /
항목 :