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Transient Liquid Phase Bonding for High Temperature Interconnects
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| 자료유형 | 학위논문 |
|---|---|
| 서명/저자사항 | Transient Liquid Phase Bonding for High Temperature Interconnects. |
| 개인저자 | Holaday, John R. |
| 단체저자명 | Purdue University. Materials Engineering. |
| 발행사항 | [S.l.]: Purdue University., 2018. |
| 발행사항 | Ann Arbor: ProQuest Dissertations & Theses, 2018. |
| 형태사항 | 116 p. |
| 기본자료 저록 | Dissertation Abstracts International 80-02B(E). Dissertation Abstract International |
| ISBN | 9780438371323 |
| 학위논문주기 | Thesis (Ph.D.)--Purdue University, 2018. |
| 일반주기 |
Source: Dissertation Abstracts International, Volume: 80-02(E), Section: B.
Adviser: Carol A. Handwerker. |
| 요약 | Transient liquid phase bonding (TLPB) is a type of interdiffusion bonding between metals that has been proposed for a variety of electronic interconnect applications. TLPB has been studied as an alternative to other high temperature interconnect |
| 요약 | Research studies involving TLPB can be categorized into two types of work. Proof-of-concept studies have demonstrated the feasibility of producing TLP bonds using materials and methods either common to current commercial electronics manufacturin |
| 요약 | A second type of TLPB research has focused instead on characterizing underlying processing mechanisms such as the kinetics of IMC formation in specific TLPB candidate systems such as Cu-Sn or Ag-Sn. Solid-liquid interdiffusion couples were proce |
| 요약 | In the work presented in this thesis, a comprehensive approach is taken to TLPB design encompassing both practical bond engineering concerns but also applying analysis of key materials science concepts. First, the key thermodynamic concepts requ |
| 일반주제명 | Materials science. |
| 언어 | 영어 |
| 바로가기 | 
: 이 자료의 원문은 한국교육학술정보원에서 제공합니다. |
